4 pad ceramic package, 2.5 mm x 3.2 mm ilcx13 series ilsi america phone: 775-851-8880 ? fax: 775-851-8882? e-mail: e-mail@ilsiamerica.com ? www.ilsiamerica.com 12/20/12_e specifications subject to change without notice page 1 1 4 2 3 3 2 4 1 0.9 max. 2.5 +/-0.15 3.2 +/-0.15 connection diagram recommended pad layout dimension units: mm 1.2 0.7 0.9 0.8 3 4 1 2 2.1 1.7 1.3 1.3 product features: applications: smd package pcmcia cards small package foot print storage supplied in tape and reel pc?s compatible with leadfree processing wireless lan * not available at all frequencies. ** not available for all temperature ranges. frequency 12 mhz to 150 mhz esr (equivalent series resistance) 12.0 mhz ? 15.9 mhz 16.0 mhz ? 19.9 mhz 20.0 mhz ? 23.9 mhz 24.0 mhz ? 60.0 mhz 60.0 mhz ? 150.0 mhz (3 rd o/t) 100 ? max. 80 ? max. 60 ? max. 40 ? max. 100 ? max. shunt capacitance (c0) 3.5 pf max. frequency tolerance @ 25 ? c ? 30 ppm standard (see part number guide for more options) frequency stability over temperature ? 50 ppm standard (see part number guide for more options) crystal cut at cut load capacitance 18 pf standard (see part number guide for more options) drive level 100 w max. aging ? 5 ppm max. / year standard temperature operating 0 ? c to +70 ? c standard (see part number guide for more options) storage -40 ? c to +85 ? c standard part number guide sample part number: ilcx13 - fb1f18 - 20.000 package tolerance (ppm) at room temperature stability (ppm) over operating temperature operating temperature range mode (overtone) load capacitance (pf) frequency ilcx13 - b = 50 ppm b = 50 ppm 0 = 0c to +50c f = fundamental 18 pf standard or specify - 20.000 mhz f = 30 ppm f = 30 ppm 1 = 0c to +70c 3 = 3 rd overtone g = 25 ppm g = 25 ppm 2 = -10c to +60c h = 20 ppm h = 20 ppm 3 = -20c to +70c i = 15 ppm i = 15 ppm** 5 = -40c to +85c j = 10 ppm* j = 10 ppm** 9 = -10c to +50c d = -10c to +105c* e = -40c to +105c*
4 pad ceramic package, 2.5 mm x 3.2 mm ilcx13 series ilsi america phone: 775-851-8880 ? fax: 775-851-8882? e-mail: e-mail@ilsiamerica.com ? www.ilsiamerica.com 12/20/12_e specifications subject to change without notice page 2 pb free solder reflow profile: typical circuit: *units are backward compatible with 240c reflow processes package information: msl = 1 termination = e4 (au over ni over w base metal). tape and reel information: environmental specifications thermal shock mil-std-883, method 1011, condition a moisture resistance mil-std-883, method 1004 mechanical shock mil-std-883, method 2002, condition b mechanical vibration mil-std-883, method 2007, condition a resistance to soldering heat j-std-020c, tabl e 5-2 pb-free devices (except 2 cycles max) hazardous substance pb-free / rohs / green compliant solderability jesd22-b102-d method 2 (preconditioning e) terminal strength mil-std-883, method 2004, test condition d gross leak mil-std-883, method 1014, condition c fine leak mil-std-883, method 1014, condition a2, r1=2x10-8 atm cc/s solvent resistance mil-std-202, method 215 marking line 1: i-date code (yww) line 2: frequency quantity per reel 1000 a 8.0+/-.2 b 4.0 +/-.2 c 3.5 +/-.2 d 16.5 +/-2 e 50 / 60 / 80 f 180
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